Calculation and experimental validation of impedance of buried single-core bonding leads

The development of digital twins for high‑voltage (HV) and extra‑high‑voltage (EHV) cable systems requires accurate electromagnetic modelling, particularly for predicting overvoltages and electrical stresses arising during transient events. A key parameter in these simulations is the impedance of bonding leads, whose evaluation becomes non-trivial when single‑core cables are buried and arranged in irregular loop geometries. This paper investigates the frequency‑dependent input impedance of buried single‑core bonding leads through a combined analytical, numerical, and experimental approach. Two loop configurations—a circular loop and a rectangular loop, each 20 m in total length—were modelled using analytical inductance formulae, Finite Element Method (FEM), and Method of Moments (MoM).…