Design and thermal conductivity enhancement strategies of MWCNTs-PDA@BCN coaxial nanotube structures and their epoxy composites

With the continuous development of electrical and electronic equipment towards high integration, the heat dissipation problem of electrical and electronic equipment has become increasingly prominent. Aiming at the bottleneck of low thermal conductivity of ordinary epoxy resins, this study proposes a strategy combining van der Waals force assembly of BN fillers and 1D/2D "line-plane" bridging structure by coordinating the adhesion and assembly of BN fillers on the surface of glass fiber cloth with MWCNTs-PDA@BCN (sintered from dopamine-pretreated MWCNTs). Using epoxy resin as the matrix, a modified glass fiberreinforced epoxy composite with excellent thermal conductivity was successfully prepared.